Current Research Programs

Current research programs are summarized in the Electronic Systems Cost Modeling Laboratory web pages and the ESCML Electronic Part Obsolescence web site.  All of the programs focus on the analysis of complex electronic systems, and specifically the packaging and interconnection technologies associated with the physical implementation of the systems.

Completed Research Programs

The following are significant research programs have been concluded:

• Electronic Packaging (Life Cycle Costing and Reliability)
  • Advanced Embedded Passives (NIST ATP) - develop and apply detailed cost models for substrates with embedded passives.  Using the models developed within this program, compare the economics of applications implemented with discrete passives to implementation using embedded passives.
  • Physics of Failure Approach to Sustainable Electronic Systems (PASES) (USAF ManTech) - decrease life cycle costs by managing life cycle risks associated with the design and manufacturing of sustainable military electronic systems by instituting a cradle-to-grave Physics of Failure (PoF) based program as a pro-active approach to achieving system reliability, manufacturability, technology risk management, and affordability.  This program integrates PoF based virtual qualification of systems with detailed life cycle cost modeling that includes models for assessing the economic impact of reliability and obsolescence.
  • Advanced Electrical Power Systems (Office of Navel Research) - AEPS refers to a packaging concept that replaces complex power electronics circuits with a single multi-function device which is intelligent and/or programmable. For example, depending on the application, a AEPS might be software configured to act as an AC to DC rectifier, DC to AC inverter, motor controller, actuator, frequency changer, circuit breaker etc.  Our role in this program is the development of technical cost modeling, its application to AEPS structures, and its integration into a multi-attribute optimization environment (with thermal, reliability, and mechanical analyses).
• Design for Environment (Environmental Economics)
  • The Salvage Software Tool - Allows optimization of a product who's life cycle includes a primary build, disassembly, and a secondary build using a combination of new and salvaged parts.  Includes material used and wasted inventories coupled with detailed cost modeling.
  • PWB Fabrication Cost and Energy/Mass Balance Modeling (DARPA) - Development of a material-centric printed wiring board (PWB) fabrication model in which each activity or process step is defined in terms of what it does to the materials associated with the substrate being fabricated.  The model has been applied to conventional and photovia PWBs.
• Micro Electro-Mechanical Systems (MEMS)
  • Micromachined RF Technology (NASA JPL) - evaluate the manufacturing processes associated with fabricating advanced high-frequency modules composed of a combination of micromachined and electronic solid state components (Si/Ge HBTs). Evaluation of the manufacturing processes includes identification of the process steps, evaluating compatibility of the necessary processing, cost analysis, and yield analysis.
  • MEMS Packaging and Reliability Assessment (NSWC Indian Head) - identify and document the dominant defects, failure mechanisms, failure modes, and failure sites in a specific MEMS supplied by the Naval Surface Warfare Center (Indian Head, MD). The critical system features include chip-to-chip bonding, a MEMS chip fabricated using the LIGA process, and system packaging (Kovar can and plastic quad flat pack).