Summary of Experience

• Electronic part obsolescence forecasting and management
• Life cycle and manufacturing cost analysis of electronic systems
• Sustainment of electronic systems (reliability and obsolescence analysis)
• Methodology and implementation of technology tradeoff analysis for electronic systems
• Design-to-cost
• Design-for-manufacturability
• Design-for-environment
• MEMS packaging and reliability
• C, C++, and web-based client/server (Java) design tool development.

Detailed Experience

University of Maryland, College Park, Maryland
Associate Professor, Mechanical Engineering  07/98 to present

• Director of the Electronic Systems Cost Modeling Laboratory. 
• Member of the Computer Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Center.

Nu Thena Systems, Inc., Austin, Texas - Nu Thena provides software solutions for verifying the functional correctness of designs, optimizing an architectural design - including the partitioning of functionality into electronic hardware and embedded software, and establishing a test and verification framework for downstream (hardware and software) component design.
Chief Technical Officer - SavanSys  01/98 to 06/98

• Architected and implemented, web-based software tool for computing costs in a hardware/software design environment.

Savantage, Inc., Austin, Texas - Savantage provides virtual prototyping software and services to the electronic packaging and interconnect community.  Savantage, Inc. was acquired by Nu Thena Systems, Inc. in January 1998.
Chief Technical Officer   08/95 to 12/97
Vice President, Engineering   03/95 to 08/95
Founder 08/94

• Architected, implemented, and supported Savantage technology tradeoff analysis engines. This software implementation resulted in the SavanSys^TM software tool that is currently installed at Savantage customer sites worldwide.
• Developed and delivered to customers, design-to-cost and design-for-manufacturability methodology applied to electronic system assembly (SMT and MCM), die preparation (including bare die test and burn-in), and printed wiring board fabrication (conventional and microvia structures).
• Developed and delivered to customers, Savantage’s design-for-environment methodology including integrating energy/mass balance lifecycle analysis (LCA) within an activity-based manufacturing cost analysis system.
• Managed prototype and commercial development of Savantage’s web-based client/server tool, Prophet, resulting in successful delivery to customers. Performed the majority of the Java software development for the client portion of the product.
• Bid, managed, and successfully completed Savantage government contracts (DARPA MADE, DARPA Design-for-Environment - 1995-1997).
• Performed various customer support and application engineering activities, including modeling of customer fabrication and assembly lines, completing customer consulting contracts, preparing documentation, and software training.
• Participated in venture capital fund raising activities that resulted in over $3 million of financing for Savantage.

Microelectronics and Computer Technology Corporation (MCC), Austin, Texas
Senior Member of Technical Staff   02/90 to 03/95
Member of Technical Staff   03/87 to 02/90

Packaging and Interconnect Program (11/88 - 03/95)

• Developed and managed the Multichip Systems Design Advisor (MSDA) software development projects and associated government contracts (DARPA MADE, RASSP, and 93-25) - project members included Eastman Kodak, DEC, Hughes Aircraft, Bell Northern Research., Cadence, Mentor Graphics, and Intergraph.
• Performed Multichip Module (MCM) electrical design and analysis.
• Provided multidisciplinary tradeoff analysis to MCC technology development projects.
• Performed switching noise experimentation and modeling.

Computer Aided Design Program (03/87 - 11/88)

• Designed and implemented a large-signal time-domain transient simulation platform for the development of high-speed silicon and GaAs devices.

Software Development Experience

• 8 years experience writing and managing C++ software development, including 3 years in a commercial software development environment.
• 10 years experience writing and managing web-based client/server and Java development in a commercial software development environment.

Education

• Ph.D. Electrical Engineering - May, 1987
  University of Michigan, Ann Arbor, Michigan
  Dissertation Title: Two-Dimensional Modeling of Gallium Arsenide Submicron Field-Effect Transistor Structures
  Advisor: Professor G. I. Haddad
• M.S. Electrical Science - December, 1983
  University of Michigan, Ann Arbor, Michigan
• B.S. Engineering Physics - May, 1982
  University of Colorado, Boulder, Colorado

Publications

• Author or co-author of over 100 technical papers, articles and book chapters (click here for list).
• Developer and presenter of tutorials, workshops, and short courses (click here for list).

Consulting

• Assett (2005), Electronic part obsolescence management

• UK Ministry of Defence (2004), Electronic part obsolescence forecasting and management

• Georgia Institute of Technology (2004), Top-down cost modeling for SOP applications

• United Defense (2004), Electronic part obsolescence forecasting and management

• Invensys (2003), Electronic part obsolescence forecasting and management

• Kollmorgen (2003), Electronic part obsolescence forecasting and management

• Potomac Photonics, Inc. (2002), Cost of ownership modeling for microvia printed circuit boards

• Honeywell International (2001), Contract assembly benchmarking

• IBM (2000), Electronic systems cost modeling.

• Emerson Electric Co. (2000), Supply chain management, contract assembly.

• Ericsson Radio Systems, Inc. (2000), Electronic systems cost modeling.

• Bosonics, Inc. (2000), Cost of ownership models.

• Lockheed-Martin Corporation (1999), Obsolescence analysis.

• Lucent Technologies, Inc. (1999), Provided software training and consulting on the Nu Thena SavanSys tool for technology tradeoff analysis of electronic packaging.

• Trimble Navigation, Limited (1998), Microvia printed circuit boards and chip scale packages.

Other Activities

Associate Editor:

• IEEE Trans on Electronics Packaging Manufacturing (1998-Present)

Editorial Board:

• International Journal of Performability Engineering (2005-present)

Program Committee:

• IEEE Multichip Module Conference, Santa Cruz, CA (1994)

• ESTC - Electronic Systemintegration Technology Conference, Dresden Germany (2006)

Reviewer:

• The Engineering Economist

• IEEE Transactions on Electron Devices

• IEEE Transactions on Circuits and Systems

• IEEE Transactions on Components, Packaging, and Manufacturing Technology–Parts A, B, C

• IEEE Transactions on VLSI

• IEEE Design & Test of Computers

• IEEE Transactions on Computer Aided Design

• IEEE Trans on Automation Science and Engineering

• Microelectronics Reliability

• Journal of Industrial Ecology

• Design Automation Conference (DAC)

• InterPACK Conference

• ASME DFM Conference

NSF Panels:       

• DMII-MES Unsolicited Panel (Janet Twomey) - February 5, 2003

• DMII-NM Optics Processing and Manufacturing (Julie Chen) – July 10, 2003 (prepared and submitted 2 reviews, did not attend panel session)

• DMII-ED Unsolicited Panel (Delcia Durham) - December 9, 2003

Roadmapping:

• Author - SIA CAD Tool roadmap (1994)

• Member - NEMI Passive Components Technology Working Group (2000, 2002 and 2004)

• Member - U.S. Navy TRENT Shareholder Council (October 2004 to present)

• Member - Honeywell Contract Assembly Benchmarking Team (2002-present)

• Member - iNEMI Optical Substrates Working Group (2005-present)

• Visitor - Common Use Tools Committee - DMSMS Center of Excellence (2005-present)

• Author - DMSMS Capability Assessment Criteria and Tool/Data Taxonomy for the DLA (2005, 2006)