Books
P. Sandborn, Course Notes on Manufacturing and Life Cycle Cost Analysis of Electronic Systems, CALCE EPSC Press, 2005.
M. Pecht, R. Solomon, P. Sandborn, C. Wilkinson, and D. Das, Life Cycle Forecasting, Mitigation Assessment and Obsolescence Strategies, CALCE EPSC Press, 2002.
P. A. Sandborn and H. Moreno, Conceptual Design of Multichip Modules and Systems, Kluwer Academic Publishers, 1994.
Book Chapters
Seven chapters in Parts Selection and Management, M. Pecht editor, John Wiley & Sons, Inc., New York, NY, 2004:
- M. Jackson, P. Sandborn, and M. Pecht, “Methodology for Parts Selection and Management,” pp. 15-26.
- P. Sandborn, and C. Wilkinson, “Product Requirements, Constraints, and Specifications,” pp. 27-36.
- D. Das and P. Sandborn, “Candidate Parts Selection: Making the First Cut,” pp. 57-62.
- A. Mather, R. Solomon, P. Sandborn, and M. Pecht, “Equipment Supplier Intervention Techniques,” pp. 139-144.
- P. Sandborn and M. Pecht, “Assembly Requirements and Constraints Assessment,” pp. 203-230.
- M. Pecht, R. Solomon, P. Sandborn, C. Wilkinson, and D. Das,” Obsolescence Prediction and Management,” pp. 231-264.
- P. Sandborn, “Part Acceptance and Risk Management,” pp. 265-278.
P. Sandborn, "The Economics of Embedded Passives," in Integrated Passive Component Technology, R. Ulrich and L. Schaper editors, Wiley-IEEE Press, 2003.
P. A. Sandborn and M. Abadir, "Multichip Module Design," Multichip Modules, Design, Fabrication, and Testing, J. J. Licari editor, McGraw-Hill, Inc, pp. 21-78, 1995.
P. A. Sandborn and D. J. Herrell, "Electronic Module Technology," Physical Architecture and Packaging of Microelectronic Systems, R. Hannemann, A. Kraus and M. Pecht editors, John Wiley & Sons, Inc, New York, NY, pp. 189-249, 1994.
Papers
Z. Shi and P. Sandborn, "Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly," to be published Journal of Electronic Testing Theory and Applications (JETTA).
M. Deeds and P. Sandborn, ”MOEMS Chip-Level Optical Interconnect,” IEEE Trans. on Advanced Packaging, Vol. 28, No. 4, pp. pp. 612-618, Nov. 2005.
D.P. Fitzgerald, J.W. Herrmann, P.A. Sandborn, L.C. Schmidt, and T.H. Gogoll, "Beyond Tools: A Design for Environment Process," International Journal of Performability Engineering, Vol. 1, No. 2, pp. 105-120, October 2005.
L.J. Salzano II, C. Wilkinson, and P.A. Sandborn, "Environmental Qualification Testing and Failure Analysis of Embedded Resistors," IEEE Trans. on Advanced Packaging, Vol. 28, No. 3, pp. 503-520, August 2005.
A. Kleyner and P. Sandborn, “A Warranty Forecasting Model Based on Piecewise Statistical Distributions and Stochastic Simulation,” Reliability Engineering and System Safety, Vol. 88, No. 3, pp 207-214, June 2005.
P. Sandborn, “An Assessment of Embedded Resistor Trimming and Rework,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 28, No. 2, pp. 176-186, April 2005.
P. Sandborn, F. Mauro, and R. Knox, "A Data Mining Based Approach to Electronic Part Obsolescence Forecasting," Proc. DMSMS Conference, Nashville, TN, April 2005.
P. Singh and P. Sandborn, “Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems,” Proc. Reliability and Maintainability Symposium (RAMS), Arlington, VA, Jan. 2005.
P. Sandborn, “A Decision Support Model for Determining the Applicability of Prognostic Health Management (PHM) Approaches to Electronic Systems,” Proc. Reliability and Maintainability Symposium (RAMS), Arlington, VA, Jan. 2005.
P. Sandborn, "Beyond Reactive Thinking – We Should be Developing Pro-Active Approaches to Obsolescence Management Too!," DMSMS Center of Excellence Newsletter, Vol. 2, Issue 3, pp. 4 and 9, July 2004.
P. Sandborn and P. Singh, "Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronics Systems," Logistics Spectrum, Vol. 38, No. 2, pp. 25-28, April-June 2004.
P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, "Electronic Part Obsolescence Driven Design Refresh Planning," International Journal of Agile Manufacturing, Vol. 7, No. 1, pp. 23-32, 2004.
A. Kleyner, P. Sandborn, and J. Boyle, " Minimization of Life Cycle Costs Through Optimization of the Validation Program – A Test Sample Size and Warranty Cost Approach," Proc. Reliability and Maintainability Symposium, Los Angeles, CA, Jan. 2004.
P. Sandborn, T. Herald, J. Houston, and P. Singh, "Optimum Technology Insertion into Systems Based on the Assessment of Viability," IEEE Trans. on Components and Packaging Technologies, Vol. 26, No. 4, pp. 734-738, December 2003.
M. Wood, D. Fritz, D. Sawoska, Frank Durso, L. Salzano, and P. Sandborn, "Performance of Plated Additive Resistors," Proc. Taiwan Printed Circuit Association Meeting, October 2003.
Z. Shi and P. Sandborn, "Optimization of Test/Diagnosis/Rework Location and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms," Proc. International Test Conference, October 2003.
P. Sandborn, B. Etienne, J. W. Herrmann, and M. M. Chincholkar, "Cost and Production Analysis for Substrates with Embedded Passives," Circuit World, Vol. 30, No. 1, pp. 25-30, 2003.
Z. Shi and P. Sandborn, "Modeling Test, Diagnosis, and Rework Operations and Optimzing Their Location in General Manufacturing Processes," Proceedings ASME 8th Design for Manufacturing Conference, Chicago, IL, September 2003.
P. Sandborn, "A Review of the Economics of Embedded Passives," Proceedings of InterPACK, July 2003.
P. Sandborn, "The Economics of Embedded Passives," in Integrated Passive Component Technology, R. Ulrich and L. Schaper editors, Wiley-IEEE Press, 2003.
R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, “Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging,” IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 141-151, May 2003.
J. P. Dougherty, J. Galvagni, L.
Marcanti, R. Sheffield
P. Singh, P. Sandborn, D. Lorenson, and T. Geiser, "Determining Optimum Redesign Plans for Avionics Considering Electronic Part Obsolescence Forecasts," in Proc. World Aviation Congress, Phoenix, AZ, November 2002. (SAE Technical Paper: 2002-1-3012)
D. Humphrey, W. Shawlee, P. Sandborn, and D. Lorenson, "Aging Aircraft Usable Life and Wear-out Issues," in Proc. World Aviation Congress, Phoenix, AZ, November 2002. (SAE Technical Paper: 2002-1-3013)
P. Sandborn and P. Singh, "Electronic Part Obsolescence Driven Design Refresh Optimization," in Proc. FAA/DoD/NASA Aging Aircraft Conference, San Francisco, CA, September 2002.
P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, "Electronic Part Obsolescence Driven Design Refresh Optimization," Proc. International Conference on Concurrent Engineering, pp. 961-970, Cranfield University, UK, July 2002.
D. Ragan, P. Sandborn, and P. Stoaks, “A Detailed Cost Model for Concurrent Use With Hardware/Software Co-Design,” IEEE Design Automation Conference, New Orleans, LA, pp. 269-274, June 2002.
B. Ramakrishnan, P. Sandborn and M. Pecht, “Process Capability and Product Reliability,“ Microelectronics Reliability, Vol. 41, No. 12, pp. 2067-2070, December 2001.
T. Trichy, P. Sandborn, R. Raghavan, and S. Sahasrabudhe, “A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly,” in Proceedings of the International Test Conference, pp. 1108-1117, November 2001.
P. Sandborn, B. Etienne and D. Becker, "Analysis of the Cost of Embedded Passives in Printed Circuit Boards," in Proceedings of the IPC Annual Meeting, Orlando, FL, October 2001.
P. A. Sandborn, B. Etienne, and G. Subramanian, “Application-Specific Economic Analysis of Integral Passives,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 203-213, July 2001.
D. Becker and P. Sandborn, “On the Use of Yielded Cost in Modeling Electronic Assembly Processes,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 195-202, July 2001.
D. Becker and P. Sandborn, “Using Yielded Cost as a Metric for Modeling Manufacturing Processes,” ASME 6th Design for Manufacturing Conference, Pittsburgh PA, September 2001.
J. Dougherty, J. Galvagni, L.
Marcanti, P. Sandborn
P. Sandborn and C. F. Murphy, "Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis," in Proc. of the Electronic Components and Technology Conference, May 2001, pp. 1261-1266.
B. Etienne and P. A. Sandborn, “Application-Specific Economic Analysis of Integral Passives,” in Proceedings of the IMAPS Advanced Packaging Materials Processes, Properties and Interfaces Symposium, Braselton GA, March 2001, pp. 399-404.
R. Solomon, P. Sandborn and M. Pecht, “Electronic Part Life Cycle Concepts and Obsolescence Forecasting,” to be published IEEE Trans. on Components and Packaging Technologies, December 2000.
P. Sandborn, “Printed Circuit Board Virtual Prototyping,” The Board Authority, vol. 2, no. 4, Dec. 2000, pp. 6-10.
P. Sandborn, D. T. Allen, and C. F. Murphy, "New Course Development in Products and Systems Cost Analysis," in Proc. of the Electronic Components and Technology Conference, May 2000, pp. 1021-1026.
M. Deeds, K. Cochran, P. Sandborn and R. Swaminathan, "Packaging of a MEMS Based Safety and Arming Device," in Proc. ITHERM, May 2000, pp.107-112.
P. Sandborn, R. Swaminathan, G. Subramanian, M. Deeds, and K. Cochran, "Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices," in Proc. ITHERM, May 2000, pp. 133-140.
C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, "Equipment Supplier Intervention Techniques," Future EMS International, Vol. 3, 2000, pp. 97-100.
Xie, C. Hillman, P. Sandborn, M. Pecht, Hassanzadeh, and DeDonato, "Assessing the Operating Reliability of Land Grid Array Elastomer Sockets," IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, March 2000, pp. 171-176.
Y. Joshi and P. Sandborn, "Electronic Products and Systems Research and Education for the 21st Century," Future Circuits International, Vol. 6, 2000, pp. 88-91.
P. Sandborn and P. Spletter, "A Comparison of Routing Estimation Methods for Microelectronic Modules," Microelectronics International, December 1999, pp. 36-41.
G. Subramanian, M. Deeds, K. Cochran, R. Raghavan, and P. Sandborn, "Delamination Study of Chip-to-Chip Bonding for a LIGA Based Safety and Arming System," Proc. SPIE Symposium on Micromachining and Microfabrication, Sept. 1999, pp. 112-119.
M. Jackson, P. Sandborn, M. Pecht, C. Hemens-Davis and P. Audette, "A Risk-Informed Methodology for Parts Selection and Management," Quality and Reliability Engineering International, vol. 15, September 1999, pp. 261-271.
H. Last, M. Deeds, D. Garvick, R. Kavetsky, P. Sandborn E. B. Magrab, and S. K. Gupta, "Nano-to-Millimeter Scale Integrated Systems," IEEE Transactions on Components and Packaging Technologies, June 1999, pp. 338-243.
M. Pecht, P. Sandborn, and P. McCluskey, "Virtual Component Qualification," in Proc. 2nd International Conf. on Modeling and Simulation of Microsystems, April,1999, pp. 8-13.
P. A. Sandborn and C. F. Murphy, "A Model for Optimizing the Assembly and Disassembly of Electronic Systems," IEEE Trans. on Electronics Packaging Manufacturing, vol. 22, no. 2, April 1999, pp. 105-117.
P. Sandborn, "Analyzing Packaging Trade-Offs During Packaging Design," in Proc. Electronics Packaging '99, Stockholm, Sweden, March 1999.
P. Sandborn and P. McCluskey, "Reliability Predictions for Plastic Packages," in Proc. Electronics Packaging '99, Stockholm, Sweden, March 1999.
M. Lindell, P. Stoaks, P. A. Sandborn, and D. Carey, "The Role of Physical Implementation in Virtual Prototyping of Electronic Systems," IEEE Trans. on Components, Packaging, and Manufacturing Technology – Part A, December 1998, pp. 610-616.
P. A. Sandborn and M. Vertal, "Packaging Tradeoff Analysis: Predicting Cost and Performance During System Design," IEEE Design & Test of Computers, vol. 15, no. 3, July-September 1998, pp. 10-19.
P. A. Sandborn and C. F. Murphy, "Material-Centric Modeling of PWB Fabrication: An Economic and Environmental Comparison of Conventional and Photovia Board Fabrication Processes," IEEE Trans. on Components, Packaging, and Manufacturing Technology – Part C, vol. 21, April 1998, pp. 97-110.
C. F. Murphy, C. Mizuki, and P. A. Sandborn, "Implementation of DFE in the Electronics Industry Using Simple Metrics for Cost, Quality, and Environmental Merit," in Proc. IEEE International Symposium on Electronics & the Environment, May 1998, pp. 219-224.
P.Sandborn, "Performing Design Tradeoffs for Advanced Printed Wiring Boards," CircuiTree, March 1998, pp. 112-118.
P. Sandborn, "Integrating Environmental Inventory Analysis with Detailed Printed Circuit Board Fabrication Cost Modeling," in Proc. 19th AESP/EPA Pollution Prevention & Control Conference, Jan. 1998, pp. 177-183.
P. Sandborn, "Performing Design Tradeoffs for Advanced PWBs," IPC National Conference on Organic High Density Interconnect Structures, Santa Clara, CA, pp. 131-149, Nov. 1997.
P. E. Stoaks and P. A. Sandborn, "Modeling the Impact of Packaging During High-Level System Design: The Integration of Physical Partitioning into Virtual Prototyping," Proc. of the High-Level Electronic Design Conference, San Jose, CA, pp. 197-204, Oct. 1997.
P. A. Sandborn and C. F. Murphy, "Evaluating the Cost Impact of Design-for-Environment Decisions Early in the Product Design Cycle," Proc. of the IPC Works, Washington DC, pp. S03-9-1 to S03-9-7, Oct. 1997.
P. A. Sandborn, "Enabling Early Design for Manufacturability via the Web," Presented at Daratech Conference, Los Angeles, CA, July 1997.
C. A. Palesko and P. A. Sandborn, "System-Level Impact of Early Packaging Decisions," Proc. of INTERpack, June 1997.
C. Murphy, P. Sandborn, and J. Lott, "An Environmental and Economic Comparison of Additive and Subtractive Approaches for Printed Wiring Board Fabrication," Proc. IEEE International Symposium on Electronics and the Environment, May 1997.
P. A. Sandborn, "Cost Analysis Helpful in Design Planning," Electronic Engineering Times, pp. 96, April 14, 1997.
P. A. Sandborn, J. W. Lott, and C. F. Murphy, "Material-Centric Process Flow Modeling of PWB Fabrication and Waste Disposal," Proc. IPC Printed Circuits Expo., pp. S10-4-1 - S10-4-12, March 1997.
C. F. Murphy, M. Abadir, and P. Sandborn, "Economic Analysis of Test and Known Good Die or Multichip Assemblies," Journal of Electronic Testing (JETTA), pp. 151-166, 1997.
C. F. Murphy and P. A. Sandborn, "Cost and Environmental Metrics for a High Density Laminate Technology," Proceedings of the Sixteenth International Electronics Manufacturing Technology Symposium (IEMT), Austin, TX, Oct. 1996.
P. Sandborn, "Linking System Design to Manufacturing," Printed Circuit Fabrication, vol. 20, no. 3, pp. 32-37, March 1997. Also in the Proc. IPC National Conference on Solutions for Ultra High Density PWBs, Los Angeles, CA, Oct 1996.
P. Sandborn and P. Spletter, "A Comparison of Routing Estimation Methods for Microelectronic Modules," Proc. of the International Electronic Packaging Conference, pp. 651-663, Sept-Oct, 1996.
P. Sandborn, "Optimizing the Design of High-Density Systems," Electronic Packaging & Production, pp. 53-60, Sept. 1996.
P. A. Sandborn and G. McFall, "Performing Design for Environment Concurrent with Interdisciplinary Tradeoff Analysis of Electronic Systems," Proc. IEEE International Symposium on Electronics and the Environment, pp. 167-172, May 1996.
P. A. Sandborn, C. Palesko, D. Gullickson, and K. Drake, "The Emergence of `Physical Synthesis’ - Optimization of a System’s Physical Implementation During Design Planning," Proc. ACM/SIGDA Physical Design Workshop, pp. 228-233, 1996.
P. Sandborn, "Advisors Can Ease Physical Design," Electrical Engineering Times, June 12, 1995.
P. A. Sandborn and A. R. Parikh, "Tradeoff Analysis and Partitioning in Multiple Board/MCM Systems," Proc. of the International Conference and Exposition on Multichip Modules, pp. 401-406, April 1995.
P. Dekhordi, K. Ramamurthi, D. Bouldin, H. Davidson and P. Sandborn, "Impact of Packaging Technology on System Partitioning: A Case Study", Proceedings of the IEEE Multichip Module Conference, Santa Cruz, CA, Feb. 1995.
M. Abadir, A. Parikh, L. Bal, C. Murphy, and P. Sandborn, "High Level Test Economics Advisor (Hi-TEA)," Journal of Electronic Testing (JETTA), vol. 5, nos. 2/3, pp. 195-206, May/August 1994.
P. A. Sandborn, R. Ghosh, K. Drake, M. Abadir, L. Bal, and A. Parikh, "Multichip Systems Tradeoff Analysis Tool," Journal of Electronic Testing (JETTA), vol. 5, nos. 2/3, pp. 207-218, May/August 1994.
P. A. Sandborn, H. Hashemi, L. Bal, and M. Abadir, "Technology Application Tradeoff Studies in Multichip Systems," IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 17, no. 2, pp. 161-169, May 1994.
P. A. Sandborn, M. Abadir, and C. Murphy, "The Tradeoff Between Peripheral and Area Array Bonding of Components in Multichip Modules," IEEE Trans. on Components, Packaging, and Manufacturing, vol. 17, no. 2, pp. 249-256, June 1994.
M. S. Abadir, A. R. Parikh, P. A. Sandborn, K. Drake, and L. Bal, "Analyzing Multichip Module Testing Strategies," IEEE Design & Test of Computers, vol. 11, no. 1, pp. 40-52, Spring 1994.
P. A. Sandborn, M. Abadir, and C. Murphy, "A Partitioning Advisor for Studying the Tradeoff Between Peripheral and Area Array Bonding of Components in Multichip Modules," Proceedings of the International Electronics Manufacturing Technology Symposium (IEMT), pp. 271-276, Santa Clara, CA, Oct. 1993.
P. Sandborn, "Computer Aided Conceptual Design of Multichip Systems," Proceedings of the IEEE Custom Integrated Circuits Conf. (CICC), pp. 29.4.1-29.4.4, San Diego, CA, May 1993.
P. A. Sandborn, "Tradeoff Analysis for a 300 MHz Module," Presented at the Workshop on Interconnections within High-Speed Digital Systems, Santa Fe, NM, May 1993.
P. A. Sandborn, H. Hashemi, and L. Bal, "Design of MCMs for Insertion into Standard Surface Mount Packages," Proceedings of the National Electronic Packaging and Production Conference (NEPCON-West), Anaheim, CA, February 1993, pp. 651-660.
P. Sandborn, "Comparing MCM Technologies," Advanced Packaging, vol. 2, no. 1, pp. 40-43, Winter 1993.
S. H. Hashemi, P. A. Sandborn, D. Disko, and R. Evans, "The Close Attached Capacitor: a Solution to Switching Noise Problems," IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 6, pp. 1056-1063, Dec. 1992.
P. A. Sandborn, "Technology Application Tradeoff Studies in Multichip Systems," Proceedings of the 1st International Conference on MCM's, Denver, CO, pp. 150-159, April 1992.
P. A. Sandborn, and K. Drake, "CAD Specification for Multichip System Packaging", Proceedings of the 1991 VLSI and GaAs Packaging Workshop, pp. 43-45, Oct. 1991
P. A. Sandborn, "A Software Tool for Technology Tradeoff Evaluation in Multichip Packaging," Proceedings of the Eleventh International Electronics Manufacturing Technology Symposium (IEMT), San Francisco, CA, pp. 337-341, Sept. 1991.
P. Sandborn, "A Tool for Evaluating Performance and Technology Tradeoffs in Integrated Circuit Packaging," Proceedings of NEPCON-East, pp. 569-576, June 1991.
P. A. Sandborn, "CAD for Multichip Packaging: Issues for Today and Needs for the Future," Proceedings of the SRC Topical Research Conference on IC Packaging Design, Analysis and Simulation, pp. 9-12, May 1991.
H. Hashemi and P. A. Sandborn, "Close Attached Capacitors for MCM Decoupling", presented at the National Electronic Packaging and Production Conference (NEPCON-West), February 1991.
P. A. Blakey, X. -L. Wang, C. M. Maziar, and P. A. Sandborn, "A New Technique for Including Overshoot Phenomena in Conventional Drift-Diffusion Simulators," Computational Electronics, K. Hess, J. P. Leburton, and U. Ravaioli editors, Kluwer Academic Publishers, pp. 51-54, 1991.
P. A. Sandborn, H. Hashemi, and B. Weigler, "Switching Noise in a Medium Film Copper/ Polyimide Multichip Module", Proceedings of the SPIE International Symposium on Advances in Interconnects and Packaging, Boston, MA, pp. 177-186, Nov. 1990.
P. A. Sandborn and H. Hashemi, "A Design Advisor and Model Building Tool for the Analysis of Switching Noise in Multichip Modules," Proceedings of the 1990 International Symposium on Microelectronics (ISHM), Chicago, IL, pp. 652-657, Oct. 1990.
H. Hashemi, U. Ghoshal, K. Ziai, and P. A. Sandborn, "Analytical and Simulation Study of Switching Noise in CMOS Circuits," Proceedings of the 1990 International Electronics Packaging Conference (IEPS), Marlborough, MA, pp. 762-773, Sept. 1990.
P. A. Sandborn, H. Hashemi, and K. Ziai, "Switching Noise in ECL Packaging and Interconnect Systems," Proceedings of the IEEE 1990 Bipolar Circuits and Technology Meeting (BCTM), Minneapolis, MN, pp. 148-151, Sept. 1990.
H. Hashemi and P. A. Sandborn, "Design and Analysis for a Reduced Parasitic Power Distribution System", presented at the Ninth Annual VLSI and GaAs Packaging Workshop, Boston, MA, Sept. 1990.
P. A. Sandborn and P.A. Blakey, "MESFET Simulation Oriented Toward Computer-Aided Microwave Circuit Design", IEEE Trans. on Microwave Theory and Techniques, vol. 38, pp. 426-429, April 1990.
P. A. Sandborn, A. Rao, and P. A. Blakey, "An Assessment of Approximate Non-Stationary Transport Models for Use in GaAs Device Modeling," IEEE Trans. Electron Devices, vol. 36, no. 7, pp. 1244-1253, July 1989.
P. A. Sandborn, J. R. East, and G. I. Haddad, "Diffusion Effects in Short-Channel GaAs MESFETs," Solid-State Electronics, vol. 32, no. 3, pp. 191-198, March 1989.
P. A. Blakey, S. A. Burdick, and P. A. Sandborn, "On the Use of Thornber's Augmented Drift-Diffusion Equation for Modeling GaAs Devices," IEEE Trans. Electron Devices, vol. 35, no. 11, pp. 1991-1994, Nov. 1988.
P. A. Sandborn, J. R. East, and G. I. Haddad, "Quasi-Two-Dimensional Modeling of GaAs MESFET's," IEEE Trans. Electron Devices, vol. ED-34, no. 5, pp. 985-991, May 1987.
P. A. Sandborn and V. A. Sandborn, "Periodic Vortex Formation in Combined Free and Forced Convection," Trans. of the ASME-J. of Heat Transfer, vol. 102, no. 1, pp. 174-177, Feb. 1980.
Tutorials
P. Sandborn, “Electronic Part Obsolescence Forecasting and Management,”
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Harris Corporation/FAA, Washington DC, January 24, 2006.
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Storage Technology Corporation, Louisville, CO, June 9-10, 2005.
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Motorola, Schaumburg, IL, February 23, 2005.
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Westland Helicopters/UK MOD, Yeovil, UK, October 10, 2004.
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United Defense, Minneapolis, MN, February 20, 2004.
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Invensys, Foxboro, MA, November 19, 2003.
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Kollmogen, Northampton, MA, August 26, 2003.
P. Sandborn, “Product and System Cost Analysis,”
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University of Maryland, January, 2002.
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IVF, Gottenburg Sweden, November, 2001.
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IBM, Poughkeepsie, NY, November 9-10, 2000.
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University of Maryland, October 9, 2000.
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Ericsson Radio Systems, Stockhom, Sweden, March 29-31, 2000.
P. Sandborn, MOCA Tool Training, Lockheed Martin, Orlando, FL, April, 14, 2004.
C. Hillman, P. Sandborn, B. Birch, D. McCabe, L. Knauss, and D. Harpel, “Printed Circuit Assemblies: New Strategies for Ensuring Reliability,” University of Maryland, August 22, 2000.
L. Condra, C. Lee, M. Pecht, and P. Sandborn, “Excellence in Avionics Supply Chain Management,” University of Maryland, August 10, 2000.
P. Sandborn, "Parts Selection and Management Workshop,"
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Microsoft, Inc., Bellevue, WA, November 3, 1999. Microsoft, Inc., Bellevue, WA, November 3, 1999.
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Smiths Industries, Cheltenham, UK, June 14, 1999. (with M. Jackson)
D. A. Doane, P. McCluskey, and P. Sandborn, "Metallization for High Density PWBs," IPC Printed Circuits Expo, San Jose, CA, March 1997.
P. A. Sandborn, E. Clark, and J. Cong, "Multichip Module Design," UCLA Extension Engineering Short Course, Los Angeles, CA, April 24-26, 1995.
P. A. Sandborn and M. Abadir, "Design, Test, and Assembly of MCMs," International Conference and Exhibition on Multichip Modules, Denver, CO, April 1994.
P. A. Sandborn and M. Abadir, "Tradeoff Studies for Multichip Systems," IEEE Multichip Module Conference, Santa Cruz, CA, March 1994.
P. A. Sandborn and H. Moreno, "Early Design of Multichip Systems," IEEE Multichip Module Conference, Santa Cruz, CA, March 1992.